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Signal Integrity Issues and Printed Circuit Board
Signal Integrity Issues and Printed Circuit Board

Signal Integrity Issues and Printed Circuit Board Design by Douglas Brooks

Signal Integrity Issues and Printed Circuit Board Design



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Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks ebook
Format: djvu
Publisher: Prentice Hall International
ISBN: 013141884X, 9780131418844
Page: 409


This article presents a brief overview of board level simulation for high-speed, multilayer PCB design and highlights some common traps and some tips so hopefully you get it right first time. Several things could go wrong - including pin assignments that don't work in the board layout, signal integrity problems on the board, and parasitic package inductance. As system operating frequencies are increasing, PCB layout is becoming increasingly complex. Its low dielectric constant and low dissipation factor make it an ideal candidate for broadband circuit designs requiring fast signal speeds or improved signal integrity. Innovative Signal Integrity & Backplane Solutions (by Bert Simonovich) PCB Vias – An Overview. HyperLynx PCB Analysis Blog: The HyperLynx team discusses Signal & Power Integrity issues in today's digital designs. Cadence recently acquired FPGA/PCB "co-design" technology that automates and optimizes pin assignments, and PCB signal-integrity software is widely available. With 2 comments · image Vias make electrical connections between layers on a printed circuit board. A successful high-speed PCB must effectively integrate high speed ASIC's and other components to optimize signal integrity. I like the discussion of how twisted pair wire helps prevent radiation. They can carry signals or power between layers. So although the package and your clock speed have not changed a problem may exist for legacy designs. Fortunately, help is available for each of these problems. May 3rd, 2010, by Steve McKinney | Permalink · Share. This article comes from the book Signal Integrity Issues and Printed Circuit Board Design by Douglas Brooks. For backplane designs, the most common form of Smaller vias and tighter pitch driven by large pin count BGA packages makes back-drilling impractical in these applications; due to drill bit size and tolerance issues.